The objectives are
- to engineer multifunctional structural materials which are energy efficient, eco-friendly, light weight, high temperature, corrosion and radiation resistance and
- to increase multifunctional performance in strength and toughness, thermal management, power management, signal management, surface functions. Such multifunctional and reconfigurable nanomaterials are essential for developing new interfaces and future generation of smart 3D nano-packaging (with high electrical/optical, thermal and mechanical properties, involving embedded sensor networks, real time monitoring …). Based on our knowledge ] we will continue our efforts in nano packaging regarding both electrical and thermal aspects with new focus on the following themes: material synthesis and process
- nano-crystalline graphite and carbon hybrid nanostructures for thermal management,
- CNTs for 3D integration and interconnects. We will consider requirements defined by THALES. In addition we aim to develop new thermal and electrical characterization methods and tools dedicated to nanomaterial and nano-objects/components.
Multi-physic (electromagnetic, quantum mechanics, thermal,…) modeling and multi-scale approaches are crucial for understanding and theoretically studying physical behaviors of nano-materials and test structures. Currently at Xlim, in collaboration with CINTRA, we are developing RF models of CNTs based on EM, quantum or circuit models . All these approaches are considering the quantum effects of the CNTs are proposed. The objective is to apply such models for the conception of RF components using CNTs as interconnect nano-elements. Moreover Xlim is studying electrical, thermal and mechanical couplings dedicated to RF packaging. Electrothermal couplings are currently under development and dedicated to the study of GaN power components. Thermo-mechanical approach will be developed to study mechanical constraints due to temperature variations that can induce damage and failure for the components.
Carbon nanostructures based 3D RF interconnects.